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  • Wide board (to 23” x 27”) 587mm X 705mm SMT capability
  • 10 mil (0.25mm) pitch placement capability
  • Passive placement to 0201 package
  • Eight zone convection re- flow ovens with on board profiling
  • Water soluble flux chemistries
  • Placing accuracy of .03mm / 3sigma on fine pitch components
  • 100% detection of BGA's and CCGA 's
  • Lead co- planarity check
  • In-line Automatic Optical Test
  • System Integration

Flex Integration & Test Flex



  • Any level of desired integration – from a module to a system
  • Smart Pallet Product Flow, line flexibility for multiple mixed
    product build
  • Full range of test – programmable, elevated burn- in, functional system
  • Traceability: component / sub- assy / chassis

 

 

 
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