Poly-Flex Circuits is the world's leading designer and producer of flexible circuit assemblies utilizing Polymer Thick Film (PTF) technology. Our capabilities include the ability to produce Surface Mount Technology (SMT) and flip chip assemblies with active and / or passive components. The attachment technology is Pb-Free, and is based on a patented material called Poly-Solder®, a silver loaded isotropic conductive adhesive. Poly-Solder® provides both an electrical and mechanical connection of the component leads to the circuit traces. Poly-Flex Circuits provides leading edge solutions for its customers, often at a reduced cost when compared with the existing technology. In this section you will obtain a closer look at the technical capabilities of our flex circuits.

Design
Poly-Flex Circuits' design engineers work closely with you to tailor each circuit assembly to your product specifications. You can provide us with your product specifications and we will provide complete prototype circuits and assemblies. Poly-Flex Circuits' sophisticated design and prototype capabilities allow incredibly rapid new product development. Our state-of-the-art CAD system creates the circuit design. Poly-Flex Circuits' industry leading screen printing and die-cutting stations produce the circuit quickly and accurately. Then, a vision-aided automated pick-and place system attaches the SMT onto the Poly-Solder® pads to complete the circuit assembly. The prototype is now ready for evaluation in the end product.

Design Guidelines
The Design Guidelines are intended to provide you with the information and specifications needed to utilize Poly-Flex Circuits polymer thick film technology in designing a custom flex circuit. As with any evolving technology, innovative progress will provide future opportunities to enhance the designs. All values listed here are subject to change. Custom applications may demand circuit performance outside of these parameters, but within the capability of our circuits. Poly-Flex Circuits' Sales and Engineering personnel are available both to assist in optimizing the design of your product and to provide support for the customization of your circuit assembly.

Research and Development
Custom applications often drive the need for Poly-Flex scientists to formulate new materials to meet exacting specifications. Poly-Flex Circuits' diverse staff of polymer chemists, materials scientists, and electrical and mechanical engineers devoted years of laboratory research to develop Poly-Solder®, the first conductive epoxy to reliably attach active and passive surface-mount devices onto a flexible substrate. Other custom materials developed by Poly-Flex for commercial applications include:

• Custom PTF ink systems
• Hydrophobic dielectric
• Z-axis adhesive
• Encapsulant materials
• Medical hydrogels

Clean Room Environment
The entire fabrication and SMT assembly process is accomplished in Class 10,000 or better clean rooms. In addition to supporting the high quality standard for the product, this also enables the customer to introduce the finished product directly into their clean room environment.

Technical Bulletins
Tactile Polyester Dome
Flip Chip
Polymer Thick Film Material Performance and Reliability