Wafer Fabrication:	Silicon wafer processing, including the compliment of diffusion, photo / etch, and metal deposition for small-signal and power NPN and PNP planar and mesa structures.
Assembly:	Eutectic and solder re-flow die attachment.
Wire Bonding:	1 mil. to 20 mil. Aluminum. All wire bonding is done under laminar flow hoods, with ESD protection.
Cap weld:	Capacitance discharge and seam seal.
Test:	Fully automatic and semi-automatic test equipment, from manufacturers such as Eaton, TESEC, and Frothingham is used to test the entire product offering. STC has full AC and DC test capability throughout temperature range of -65C to +200C.
Burn-in:	STC has over 40,000 available positions for DC burn-in and high temperature reverse bias (HTRB) screening.
Environmental:	Full laboratory capability, ranging from Temperature Cycle to Moisture Resistance, using MIL-STD-750 approved methods and procedures.
Mechanical:	Drop shock and vibration, as well as tension, torque, lead stress, etc.

STC welcomes opportunities to perform wafer fabrication, assembly, or test for your products as well as for ours.

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Silicon Transistor Corporation
27 Katrina Road
Chelmsford, MA 01824
Phone 978~256~3321
Fax 978~250-1046