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High-Reliability Screening Table
Mil-Prf-19500All devices offered by STC are available screened to JANTX, JANTXV, or JANS process conditioning.
Part Number Suffix
Test Description
T
V
SL
1. Internal Visual (Pre-Cap) Inspection
n
n
2. Temperature Cycle (Thermal Shock)
n
n
n
3. Surge Note 1
n
n
n
4. Thermal Response Note 1
n
n
n
5. Acceleration
Note 2
Note 2
n
6. Particle Impact Noise Detection (PIND)
n
7. Serialization
n
8. Interim Electrical Parameters
Note 3
Note 3
n
9. High Temperature Reverse Bias (HTRB)
n
n
n
10. Interim Electrical & Delta Parameters
n
n
n
11. Burn-in
n
n
n
12. Interim Electrical & Delta Parameters
n
n
n
13. Final Electrical Parameters (DC = 100%, AC = LTPD)
n
n
n
14. Hermetic Seal (Fine and Gross Leak)
n
n
n
15. Radiography (X-Ray)
n
16. External Visual Examination
n
All screening and conditioning tests are performed in accordance with Mil-Std-750 test methods.
Note 1. Performed if test conditions are specified in the detail specification.
Note 2. Performed on gold bond devices only.
Note 3. For case mounted devices only.
"T" = Equivalent to JANTX level.
"V" = Equivalent to JANTXV level.
"SL" = Equivalent to JANS level.
Optional testing includes Particle Impact Noise Detection (add suffix "P") and Radiographic Inspection (add Suffix "X")
The governing document for screening and sequence of screening for each product family is in accordance with the latest revision of Mil-Prf-19500.
Groups A, B, and C testing are quoted upon request.
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Silicon Transistor Corporation
27 Katrina Road
Chelmsford, MA 01824
Phone 978~256~3321
Fax 978~250-1046