Mack Technologies has established a robust
board assembly operation
that includes multiple top & bottom side lines that are identically
configured. Couple this equipment strategy with a significant investment
in component feeders for offline setups and Mack Technologies is capable
of building any circuit board on any of its lines with minimum downtime
for changeovers. This translates into a highly flexible manufacturing
operation that accommodates Mack's ever-changing customer schedules.
Capabilities
Component
Types
Processes
PBGA, CBGA
Micro BGA's
16mil. QFP's
0402 Passives
VHDM Press Fit Connectors
SMT Connectors and other odd shaped components
Double Pass/Double
Reflow
Nitrogen Reflow
and Wave Solder
X-ray Inspection
BGA Repair and Placement Rework
In-line Paste Volume Inspection
High and Low
Temperature Solder
Paste-in-Hole
Reflow
No Clean Flux
Selective Wave
Solder
Closed Loop Aqueous
Wash
Test
Flying Probe
In-circuit
Functional
ESS
(static and dynamic)
Equipment List
Accommodates
multiple top and bottom side lines
Screen
Printers - DEK 265GSX
General
Dispensing Machines - Universal Instruments
GDM1
High
Speed Placement Machines - Universal Instruments
4791 HSP
Fine
Pitch Placements - Universal Instruments GSM1
Convection
Reflow Ovens - Conceptronic HVN-102
Wave
Solder w/Nitrogen - Dover Soltec Maxi 6523CC
Solder
Fountain - Wenesco M90
Aqueous
Cleaning System - Westek Triton IV Mil SMT
Organic
Water Treatment System - Westek
Ionograph
500M - Alphametals
Paste
Inspection Systems - Cybersentry
Stencil
Cleaning - Smart Sonic
Model 2000
BGA
Rework Stations - Sierra Research Technologies
(SRT)
Real-time
X-ray - Nicolet Imaging System NXR-1400i
In-Circuit
Test - Teradyne Z1884; GenRad Series TS87L
