Mack Technologies has established a robust board assembly operation that includes multiple top & bottom side lines that are identically configured. Couple this equipment strategy with a significant investment in component feeders for offline setups and Mack Technologies is capable of building any circuit board on any of its lines with minimum downtime for changeovers. This translates into a highly flexible manufacturing operation that accommodates Mack's ever-changing customer schedules.

Capabilities

Component Types	Processes
PBGA, CBGA Micro BGA's 16mil. QFP's 0402 Passives VHDM Press Fit Connectors SMT Connectors and other odd shaped components	Double Pass/Double Reflow Nitrogen Reflow and Wave Solder X-ray Inspection BGA Repair and Placement Rework In-line Paste Volume Inspection High and Low Temperature Solder Paste-in-Hole Reflow No Clean Flux Selective Wave Solder Closed Loop Aqueous Wash
	Test Flying Probe In-circuit Functional ESS (static and dynamic)

• Screen Printers - DEK 265GSX
  
• General Dispensing Machines - Universal Instruments GDM1
  
• High Speed Placement Machines - Universal Instruments 4791 HSP
  
• Fine Pitch Placements - Universal Instruments GSM1
  
• Convection Reflow Ovens - Conceptronic HVN-102
  
• Wave Solder w/Nitrogen - Dover Soltec Maxi 6523CC
  
• Solder Fountain - Wenesco M90
  
• Aqueous Cleaning System - Westek Triton IV Mil SMT
  
• Organic Water Treatment System - Westek
  
• Ionograph 500M - Alphametals
  
• Paste Inspection Systems - Cybersentry
  
• Stencil Cleaning - Smart Sonic Model 2000
  
• BGA Rework Stations - Sierra Research Technologies (SRT)
  
• Real-time X-ray - Nicolet Imaging System NXR-1400i
  
• In-Circuit Test - Teradyne Z1884; GenRad Series TS87L
  
• Flying Probe Test - Takaya 8400ce
  
• Environmental Stress Screening - Harris Chambers