The proprietary Ibis 2000 will support the volume production of high quality SIMOX-SOI 200 mm and 300 mm wafers for the global semiconductor industry. The design and development effort has commenced and the Ibis 2000 oxygen implanter is forecasted to be ready for shipping in the first quarter of 2002.

Extending the capabilities of the production-proven Ibis 1000, the advanced Ibis 2000 will substantially increase available capacity, advance process technology, increase throughput and reduce costs. The oxygen implanter will utilize next-generation beamline design to reduce the number of beamline components and improve beam transport. The modular construction of the system will enable improved serviceability and diagnostics, while simplifying the assembly and shipping of the machine. The Ibis 2000 will be bulkhead mounted in the cleanroom and offers front-opening unified pod (FOUP) capability. In addition, the improved automation and operator-friendly controls will raise the overall productivity and afford ease-of-use.

The Ibis 2000 will also offer extensive low-dose and low-energy capabilities, facilitating the use of the Advantox® product portfolio introduced last year by Ibis Technology. The portfolio significantly expands the range of commercial applications for Ibis SIMOX-SOI wafers.