VCA-3000S Wafer Surface Analysis Systems are specially design for use in semiconductor wafer processing quality control. The system provides quick and accurate contact angle/surface energy analysis on wafer surface to evaluate adhesion, cleanliness and coatings. The syringe mechanism can be raised for easy loading and unloading eliminating the possibility of wafer damage.
Although the system was designed for wafer surface analysis it is also a useful tool for any application that requires a large stage. Samples sizes up to 12"W x 12"L x .75"H can easily be accommodated by this system.
VCA-3000S Wafer System 300mm stage
APPLICATIONS
Coating assessment of the HMDS process
Surface contamination detection
Adhesive and primer preparation
Coating uniformity
Coating quality
Surface cleanliness
FEATURES
High-resolution video camera with magnifying lens with high intensity LED lighting for precise image capture
300mm rotating stage, allows access to all areas of the wafer
High-end PC standard with high-performance video board for advanced
image analysis and video capture