Poly-Flex Circuits Limited Opens Surface Mount Assembly Operation

Isle of Wight, UK and Cranston, RI - Poly-Flex Circuits, Limited (formerly NFI Electronics, Limited), a subsidiary of the Cookson Electronics Division (CED) operating under the management of Poly-Flex Circuits, Incorporated, has installed a complete turnkey Surface Mount Assembly Operation. This investment represents the first step in the global technology expansion of Poly-Flex Circuits.

Steven Corbett, President of Poly-Flex Circuits, Inc., commented:

"It is truly thrilling to see the culmination of so many people's diligent efforts in accomplishing this major milestone in the evolution of Poly-Flex Circuits. It is noteworthy that the start-up of this line comes a full four weeks ahead of schedule, driven by the superior complementary efforts of the US Engineering Team with the UK Manufacturing Team.

Our global customers have presented a significant challenge to us in their expansion, and the installation of this line in the facility acquired by Cookson Group in 1997 represents our commitment as an organization to servicing the major players in the Electronics Industry on a global scale. Other efforts are proceeding to expand our presence into the Asian marketplace as well, and combined this strategy will enable us to support our customers worldwide."

Poly-Flex Circuits Limited manufactures polymer thick film flexible circuits and custom graphics servicing the computer peripheral, automotive, industrial, medical, telecommunications, radio frequency identification (RFID) and consumer appliance markets. Poly-Flex Circuits, is an ISO 9001 certified subsidiary of the Cookson Electronics Division of Cookson Group, plc, a world leading industrial specialty electronic materials and equipment supplier.

For further information, please contact Bob Boyes at Poly-Flex Circuits, US at (401) 463-4306 or Veronica Ringer at Poly-Flex Circuits, Limited at 44 (0) 1983 526-535.