FOR IMMEDIATE RELEASE
        TO EDITORS
        Poly-Flex
        Circuits is Approved by Philips As An I-Code Inlet Manufacturer
        Cranston, RI -
        Poly-Flex Circuits, Incorporated has been approved as an inlet
        manufacturer for Philip's I-Code 13.56 MHz RFID applications.
         Poly-Flex Circuits is one of a select group of certified I-Code
        13.56 MHz packaging assemblers and the first qualified source
        in North America.
        The I-Code 13.56MHZ
        device has read / write capability where the writing distance
        is equal to that of the read distance.  The inlet can be detected
        in read / write mode at up to 1.2 meters and at 1.5 meters in
        EAS (Electronic Article Surveillance) mode. The device also contains
        anticollision circuitry, which allows for multiple inlets to
        be read in the same reader field. Other features include a low
        power consumption of 100 mW, EEPROM capacity of 512 bits and
        a transaction speed of 20 tags/second. 
        Poly-Flex Circuits
        is offering I-Code inlets on a polyester substrate. The inlet
        antenna can be etched copper or additive polymer thick film.
        The semiconductor device is bonded to the antenna circuitry via
        a flip-chip interconnection. Inlet delivery formats include individually
        singulated parts, sheets or rolls. Flip-chip assembly is an extension
        of Poly-Flex's proven, high volume, surface mount assembly capability
        specially adapted to handling a low cost polyester substrate.
        Poly-Flex's RF design engineers are available to work with individual
        customers to assist in the selection of an RFID inlet design
        and construction which maximizes read distances at the lowest
        possible cost.
        Poly-Flex Circuits,
        Inc. is an ISO 9001 certified manufacturer of flexible circuit
        assemblies and custom graphics for the telecommunications, computer
        peripheral, RFID, appliance, medical, and automotive markets.
         For over seven years, Poly-Flex Circuits has specialized in
        the high volume assembly of electronic components using Poly-Solder,
        a proprietary silver filled conductive interconnect adhesive.
        For further information on RFID applications, please contact
        Mr. Michael Jordan at Poly-Flex Circuits at (401) 463-4331 for
        North American inquiries.  In Europe, please contact Mr. John
        Entwistle at +44 1983 526535.  Also, please visit us on the Web
        at www.polyflex.com or e-mail us at pfcsales@ids.net.