FOR IMMEDIATE RELEASE
CONTACTS:
Michael Jordan
Poly-Flex Circuits, Inc.
401-463-4331
mjordan@ri.parlex.comFrancine Carb
Parelec, Inc.
c/o Markitects, Inc.
610-526-2006 x 301
fcarb@markitects.com or info@parelecusa.comPOLY-FLEX AND PARELEC ANNOUNCE RFID MANUFACTURING AGREEMENT Cranston, RI (November 14, 2000) - Poly-Flex Circuits, Inc., a leading designer and manufacturer of flexible circuit assemblies and transponders for Radio Frequency Identification ("RFID") Smart Labels, and Parelec, Inc., a prominent manufacturer of very low temperature, thick film materials for the electronic interconnect industry, jointly announced a manufacturing agreement today whereby Poly-Flex will use Parelec's Parmod® conductive ink to produce RFID transponders. Under the terms of this agreement, Poly-Flex will be the exclusive manufacturer of discrete RFID transponders employing Parmod® ink for the North American market.
Parmod® is a printable ink with conductivity approaching that of solid copper. The Parmod® ink will allow Poly-Flex to fabricate high performance RFID transponders at a very low cost. Commenting on this agreement, Dennis Carvalho, President of Poly-Flex, highlighted the benefits of the Parelec product: "Parmod® ink greatly enhances our already diverse RFID product offering. Coupled with our proprietary flip chip assembly process and materials, Poly-Flex will offer very high performance RFID transponders at an extremely competitive price. This should open up new markets for the RFID technology where conductive inks once could not meet some higher end RF specifications." Parelec executives are equally excited. "The Parmod® product line is projected to do great things," says Steven Ludmerer, President of Parelec, "RFID transponders represent the first in a series of applications for our patented technology in the printable interconnect, flex circuit and chip scale packaging markets."
ABOUT POLY-FLEX
Poly-Flex Circuits, Inc. is a subsidiary of Parlex Corporation (NASDQ: PRLX), a global supplier of flexible interconnects and circuitry to the automotive, telecommunication, networking, diversified electronics, aerospace and RFID markets. Poly-Flex has positioned itself as a leader in the manufacture of polymer thick film (PTF) flexible circuitry as a result of its innovative materials and technologies. Poly-Flex has leveraged its proprietary materials and process expertise to provide low cost, high volume production of inlets for RFID smart label markets. With access to multiple manufacturing operations in Europe, North America and Asia, Poly-Flex can provide strong local support for broad global requirements. For more information about Poly-Flex, visit www.polyflex.comABOUT PARELEC
Parelec Inc. is a privately held company leading the development, manufacture and sale of Parmod® very low temperature thick film materials. Parmod® products are in the form of inks, pastes and toners that provide pure metal conductors, resistors and capacitors in a fully additive process. The applications for Parmod® include radio frequency identification transponders, flex circuits, chip scale packaging and transistor arrays. The company's staff of executives and scientists is located in the high-tech corridor near Princeton, New Jersey. To learn more about Parmod®, contact Brian Conaghan, Director of Business Development, at 609-279-0072 or visit www.parelecusa.com.